Semiconductor device having die pads with exposed surfaces

A semiconductor device comprising:

• a first lead frame comprising a first die pad having a first surface and a second surface opposite to the first surface of the first die pad;
• a second lead frame comprising a second die pad having a first surface and a second surface opposite to the first surface of the second die pad, the first surface of the second die pad facing the first surface of the first die pad;
• a first semiconductor chip attached to the first surface of the first die pad;
• and
• an encapsulation material encapsulating the first semiconductor chip and portions of the first lead frame and the second lead frame, the encapsulation material having a first surface aligned with the second surface of the first die pad and a second surface aligned with the second surface of the second die pad, a hole through the encapsulation material extending from the first surface of the encapsulation material to the second surface of the encapsulation material.

A semiconductor device comprising:

• a first lead frame comprising a first die pad having a first surface and a second surface opposite to the first surface of the first die pad;
• a second lead frame comprising a second die pad having a first surface and a second surface opposite to the first surface of the second die pad, the first surface of the second die pad facing the first surface of the first die pad;
• a first semiconductor chip attached to the first surface of the first die pad;
• and
• an encapsulation material encapsulating the first semiconductor chip and portions of the first lead frame and the second lead frame, the encapsulation material having a first surface aligned with the second surface of the first die pad and a second surface aligned with the second surface of the second die pad, wherein the semiconductor device is a through-hole device.

A semiconductor device comprising:

• a first lead frame comprising a first die pad having a first surface and a second surface opposite to the first surface of the first die pad;
• a second lead frame comprising a second die pad having a first surface and a second surface opposite to the first surface of the second die pad, the first surface of the second die pad facing the first surface of the first die pad;
• a first semiconductor chip attached to the first surface of the first die pad;
• a second semiconductor chip attached to the first surface of the second die pad;
• and
• an encapsulation material encapsulating the first semiconductor chip and the second semiconductor chip and portions of the first lead frame and the second lead frame, the encapsulation material having a first surface aligned with the second surface of the first die pad and a second surface aligned with the second surface of the second die pad.

A method to fabricate a semiconductor device, the method comprising:

• attaching a first semiconductor chip to a first surface of a first die pad of a first lead frame, the first die pad having a second surface opposite to the first surface of the first die pad;
• attaching a second semiconductor chip to a first surface of a second die pad of a second lead frame, the second die pad having a second surface opposite to the first surface of the second die pad;
• stacking the second lead frame on the first lead frame such that the first surface of the first die pad faces the first surface of the second die pad;
• and
• encapsulating the first semiconductor chip and the second semiconductor chip and portions of the first lead frame and the second lead frame with an encapsulation material such that the second surface of the first die pad is aligned with a first surface of the encapsulation material and the second surface of the second die pad is aligned with a second surface of the encapsulation material.