Package structure and the method to fabricate thereof

A package structure, comprising:

• a lead frame, formed by a plurality of sub lead frames each being made of metal, wherein each two adjacent sub lead frames are spaced apart by a vacancy, wherein said vacancy is filled with insulating material, wherein a recess is formed in a sub lead frame;
• a substrate, comprising conductive patterns therein;
• and
• a first electronic device, disposed on a bottom surface of the substrate and electrically connected to at least one portion of the conductive patterns of the substrate;
• wherein the substrate is disposed over the plurality of sub lead frames and said vacancy with at least one portion of the first conductive element disposed in the recess;
• and
• wherein the first electronic device is electrically connected to the lead frame via at least one portion of the conductive patterns of the substrate, and a plurality of pads are disposed on the bottom surface of the lead frame, wherein a first conductive pattern and a second conductive pattern of the substrate are respectively electrically connected to a first pad and a second pad via a corresponding sub lead frame.