US 10,373,890 B1Granted

Cooling techniques for semiconductor package

AssigneeInfineon Technologies AG

InventorsJuergen Hoegerl, Andreas Grassmann

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Abstract

In some examples, a device includes a high-side switch, a first high-side conductive element electrically connected to a first load terminal of the high-side switch, and a second high-side conductive element electrically connected to a second load terminal of the high-side switch. The device also includes a layer of cooling material encapsulating the high-side switch, the first high-side conductive element, and the second high-side conductive element. The device further includes a low-side switch, a first low-side conductive element electrically connected to a first load terminal of the low-side switch, and a second low-side conductive element electrically connected to a second load terminal of the low-side switch. The layer of cooling material encapsulates the low-side switch, the first low-side conductive element, and the second low-side conductive element.

Claims20

Dependent claims

A device comprising:

a high-side switch;
a first high-side conductive element electrically connected to a first load terminal of the high-side switch;
a second high-side conductive element electrically connected to a second load terminal of the high-side switch;
a layer of cooling material encapsulating the high-side switch, the first high-side conductive element, and the second high-side conductive element;
a low-side switch;
a first low-side conductive element electrically connected to a first load terminal of the low-side switch;
a second low-side conductive element electrically connected to a second load terminal of the low-side switch, wherein the layer of cooling material encapsulates the low-side switch, the first low-side conductive element, and the second low-side conductive element;
a printed circuit board (PCB) including an electrical interface and configured to:
deliver control signals to the high-side switch based on signals received at the electrical interface;
and
deliver control signals to the low-side switch based on signals received at the electrical interface;
a first body including the cooling material, the high-side switch, the first high-side conductive element, the second high-side conductive element, the low-side switch, the first low-side conductive element, and the second low-side conductive element;
and
a second body surrounding the first body, the second body including the PCB and interconnect elements configured to receive a high-side power supply, receive a low-side power supply, and deliver an output signal,
wherein the electrical interface is at least partially exposed on the second body.

12 more elements

A device comprising:

a middle cooling element;
a high-side cooling element;
a high-side switch;
an outside high-side conductive element positioned between the high-side switch and the high-side cooling element, wherein the outside high-side conductive element is electrically connected to a high-side power supply;
a middle high-side conductive element electrically connected to a load terminal of the high-side switch, wherein the middle high-side conductive element is positioned between the high-side switch and the middle cooling element;
a low-side cooling element;
a low-side switch;
an outside low-side conductive element positioned between the low-side switch and the low-side cooling element, wherein the outside low-side conductive element is electrically connected to a low-side power supply;
and
a middle low-side conductive element electrically connected to a load terminal of the low-side switch,
wherein the middle low-side conductive element is positioned between the low-side switch and the middle cooling element, and
wherein the middle high-side conductive element is electrically connected to the middle low-side conductive element to form a C-shaped interconnect element.

9 more elements

A device comprising:

a middle cooling element;
a high-side cooling element;
a high-side switch;
an outside high-side conductive element positioned between the high-side switch and the high-side cooling element;
a middle high-side conductive element electrically connected to a high-side power supply and to a load terminal of the high-side switch, wherein the middle high-side conductive element is positioned between the high-side switch and the middle cooling element;
a low-side cooling element;
a low-side switch;
an outside low-side conductive element positioned between the low-side switch and the low-side cooling element;
and
a middle low-side conductive element electrically connected to a low-side power supply and to a load terminal of the low-side switch,
wherein the middle low-side conductive element is positioned between the low-side switch and the middle cooling element, and
wherein the outside high-side conductive element is electrically connected to the outside low-side conductive element to form a C-shaped interconnect element.

9 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/948,747Filed 9 Apr 2018
Granted: 6 Aug 2019
Term ends: Not estimatedThe source records don’t support an estimate.

Classification22 codes

H10W 40/22
Arrangements for cooling: characterised by their shape, e.g. having conical or cylindrical projections
H05K 7/20927
For power electronics, e.g. for inverters for controlling motor: liquid coolant without phase change
H10W 40/251
Characterised by their materials: organics
H10W 40/47
Involving heat exchange by flowing fluids: by flowing liquids, e.g. forced water cooling

Family

No related US applications are recorded in the indexed filing history.

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