Fan-out semiconductor package

A fan-out semiconductor package comprising:

• a connection member;
• an electronic component on the connection member;
• and
• a core member on the connection member, including a through-hole, with the electronic component located within the through-hole, and including one or more grooves along a lower surface of the core member, the one or more grooves facing the connection member and extending from the through-hole to an outer surface of the core member in the peripheral direction.

A fan-out semiconductor package comprising:

• a connection member, including an upper and lower surface, a redistribution layer, and electrical connection structures protruding from the lower surface and electrically connected to the redistribution layer;
• a semiconductor chip above the upper surface of the connection member, including connection pads on a lower surface of the semiconductor chip, facing the connection member, the connection pads electrically connected to the redistribution layer of the connection member;
• a core member above the upper surface of the connection member, including a through-hole containing the semiconductor chip, wiring layers electrically connected to the redistribution layer of the connection member, and first through fourth grooves facing the connection member and extending from respective inner corners of the through-hole to respective outer corners of the core member in the peripheral direction;
• an encapsulant, above the semiconductor chip and the core member, in the through hole between the semiconductor chip and the core member, and in at least a portion of the first through fourth grooves.