Method of separating semiconductor dies from a semiconductor substrate, semiconductor substrate assembly and semiconductor die assembly

A semiconductor die assembly, comprising:

• a plurality of semiconductor dies separated in two orthogonal horizontal directions by equally-spaced separation trenches, respectively, wherein the semiconductor dies are arranged within a circle with a first radius around a center axis of the semiconductor die assembly and the first radius is smaller than a wafer standard radius by an indentation width;
• a stiff carrier member adhered onto first surfaces at a front side of the semiconductor dies through a radiation or thermal release adhesive film;
• and
• a flexible pick-up tape adhered onto second surfaces on a back side of the semiconductor dies through a radiation or thermal release adhesive film.

A semiconductor die assembly, comprising:

• a plurality of semiconductor dies separated in two orthogonal horizontal directions by equally-spaced separation trenches, respectively, wherein the semiconductor dies are arranged within a circle with a first radius around a center axis of the semiconductor die assembly and the first radius is smaller than a wafer standard radius by an indentation width;
• and
• a flexible pick-up tape adhered onto a back side of the semiconductor dies through a radiation or thermal release adhesive film,
• wherein the indentation width is equal to or greater than a width of the separation trenches.