US 10,373,820 B2 · Deposition of organic films

Abstract

Processes are provided herein for deposition of organic films. Organic films can be deposited, including selective deposition on one surface of a substrate relative to a second surface of the substrate. For example, polymer films may be selectively deposited on a first metallic surface relative to a second dielectric surface. Selectivity, as measured by relative thicknesses on the different layers, of above about 50% or even about 90% is achieved. The selectively deposited organic film may be subjected to an etch process to render the process completely selective. Processes are also provided for particular organic film materials, independent of selectivity.

Claims25

Dependent claims

A process for selectively depositing an organic film on a substrate comprising a first surface and a second surface, the process comprising:

multiple consecutive deposition cycles each comprising:
contacting the substrate with a first vapor phase precursor;
and
contacting the substrate with a second vapor phase precursor,
wherein contacting the substrate with the first and second vapor phase precursors forms the organic thin film selectively on the first surface relative to the second surface;
and
subjecting the substrate to an etch process subsequent to the multiple consecutive deposition cycles, wherein the etch process has a chemistry for removal of organic material and removes substantially all of any deposited organic film from the second surface of the substrate and does not remove substantially all of the deposited organic film from the first surface of the substrate.

4 more elements

Dependencies are inferred from the claim text.

Deposition of organic films

Life of this patent

Deposition of organic films

Life of this patent

Abstract

Claims25