Multilayer ceramic electronic component having external electrodes with holes in plating layers

A multilayer ceramic electronic component comprising:

• a ceramic body including dielectric layers and first and second internal electrodes alternately stacked in a thickness direction and respectively exposed to opposing end surfaces of the ceramic body with each of the dielectric layers interposed therebetween;
• and
• first and second external electrodes disposed on outer surfaces of the ceramic body to be connected to the first and second internal electrodes, respectively, and disposed to cover at least five of eight corners of the ceramic body,
• wherein the first and second external electrodes include, respectively, first and second base electrode layers at least partially in contact with the outer surfaces of the ceramic body and first and second plating layers disposed to cover the first and second base electrode layers, respectively, and
• the first and second plating layers have one or more to three or less holes positioned adjacent to one or more to three or less of the eight corners of the ceramic body.