Transparent electrode film, dimming element, and method for manufacturing transparent electrode film

A dimming element comprising:

• a pair of transparent electrode substrates;
• and a dimming layer sandwiched between the pair of transparent electrode substrates, wherein
• at least one of the pair of transparent electrode substrates is a transparent electrode film comprising a transparent film base and a transparent electrode disposed on the transparent film base,
• the transparent electrode including a transparent conductive layer, a protecting layer and a conductive metal pattern layer,
• the conductive metal pattern layer being patterned in an in-plane direction of the transparent film base,
• the transparent conductive layer and the protecting layer are disposed in a region where the conductive metal pattern layer is provided, and the conductive metal pattern layer is disposed closer to the transparent film base than the transparent conductive layer and the protecting layer,
• the protecting layer is selected from the group consisting of a precious metal and a metal oxide, and
• the transparent conductive layer is disposed at an opening section where the conductive metal pattern layer is absent.

A method for manufacturing a transparent electrode film,

• the transparent electrode film includes a transparent film base, and a transparent electrode disposed on the transparent film base,
• the transparent electrode includes a transparent conductive layer and a conductive metal pattern layer,
• the method comprising the steps of:
• forming on the transparent film base the conductive metal pattern layer patterned in an in-plane direction of the transparent film base;
• forming a protecting layer including at least one selected from the group consisting of a precious metal and a metal oxide;
• and
• forming the transparent conductive layer, wherein
• the transparent conductive layer and the protecting layer are formed after formation of the conductive metal pattern layer, and
• the transparent conductive layer is formed so as to cover the conductive metal pattern layer and to cover an opening section where the conductive metal pattern layer is absent.