Fingerprint sensor, fingerprint sensor module, and method for manufacturing fingerprint sensor
AssigneeJapan Display Inc.
InventorsFumihito Shibano, Hiroshi Mizuhashi, Toshinori Uehara, Kimiyo Nonoyama, Hayato Kurasawa
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Abstract
According to an aspect, a fingerprint sensor includes a first glass substrate, a second glass substrate, and a plurality of sensor electrodes between the first glass substrate and the second glass substrate. The first glass substrate and the second glass substrate are bonded together by a sealing material with the plurality of sensor electrodes interposed therebetween.
Claims20
A fingerprint sensor comprising:
- a first glass substrate;
- a second glass substrate;
- and
- a plurality of sensor electrodes between the first glass substrate and the second glass substrate, wherein
- the first glass substrate and the second glass substrate are bonded together by a sealing material with the plurality of sensor electrodes interposed therebetween,
- wherein a gap between the first glass substrate and the second glass substrate is filled with a filler material, and
- wherein the filler material is on the plurality of sensor electrodes and is a non-displaying liquid crystal.
A method for manufacturing a fingerprint sensor, the method comprising sealing a plurality of sensor electrodes between a first glass substrate and a second glass substrate such that a gap between the first glass substrate and the second glass substrate is filled with a filler material, wherein the filler material is on the plurality of sensor electrodes and is a non-displaying liquid crystal, and
- then performing wet etching to adjust a thicknesses of the first glass substrate and the second glass substrate to be in a range of 100 μm to 300 μm.
Dependencies are inferred from the claim text.