Coupling structures for electronic device housings
AssigneeApple Inc.
InventorsBrian M. Gable, Carlo Di Nallo, Colin M. Ely, Craig A. Horton, Erik G. de Jong, Fletcher R. Rothkopf, Henry B. Wettersten, Hoishun Li, Jason C. Sauers, Jayesh Nath, Mario Martinis, Mattia Pascolini, Michael P. Coleman, Rex T. Ehman, Zheyu Wang
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