Measurement device and measurement method, exposure apparatus and exposure method, and device manufacturing method
AssigneeNikon Corporation
InventorAkihiro Ueda
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AssigneeNikon Corporation
InventorAkihiro Ueda
Estimating the term…
An alignment system is equipped with: an alignment system having an objective optical system, an irradiation system and a beam receiving system; and a calculation system, the objective optical system including an objective transparent plate that faces a wafer movable in a Y-axis direction, the irradiation system irradiating a grating mark provided at the wafer with measurement beams via the objective transparent plate while scanning the measurement beams in the Y-axis direction, the beam receiving system receiving diffraction beams from the grating mark of the measurement beams via the objective optical system, and the calculation system obtaining positional information of the grating mark on the basis of the output of the beam receiving system, wherein the objective transparent plate deflects or diffracts the diffraction beams diffracted at the grating mark toward the beam receiving system.
A measurement device, comprising:
An exposure apparatus that forms a predetermined pattern on an object by irradiating the object with an energy beam, the apparatus comprising:
A measurement method of measuring positional information of a grating mark provided at an object, the method comprising:
Dependencies are inferred from the claim text.