Display device and wiring structure
AssigneeJapan Display Inc.
InventorYasuhiro Kanaya
Life of this patent
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Abstract
According to one embodiment, a display device includes a first substrate including a semiconductor layer, a first inorganic insulating film provided above the semiconductor layer and including a first opening, an organic insulating film provided above the semiconductor layer and including a second opening in a region which overlaps the first opening, a metal film stacked on the semiconductor layer and a pixel electrode provided in the first opening and the second opening to be in contact with the metal film and the semiconductor layer, and the metal film is spaced from a first side surface of the first opening and a second side surface of the second opening.
Claims15
A display device comprising:
- a first substrate comprising:
- a semiconductor layer;
- a first inorganic insulating film provided above the semiconductor layer and comprising a first opening in a region which overlaps the semiconductor layer;
- an organic insulating film provided above the semiconductor layer and comprising a second opening in a region which overlaps the first opening;
- a metal film stacked on the semiconductor layer on an inner side of the region where the second opening is formed;
- and a pixel electrode provided in the first opening and the second opening to be in contact with the metal film and the semiconductor layer,
- the metal film being spaced from a first side surface of the first opening and a second side surface of the second opening.
A wiring substrate comprising:
- a semiconductor layer;
- a first inorganic insulating film provided above the semiconductor layer and comprising a first opening in a region which overlaps the semiconductor layer;
- an organic insulating film provided above the semiconductor layer and comprising a second opening in a region which overlaps the first opening;
- a first conductive layer stacked on the semiconductor layer on an inner side of the region where the second opening is formed;
- and
- a second conductive layer formed in the first opening and the second opening to be in contact with the first conductive layer and the semiconductor layer,
- the first conductive layer being spaced from a first side surface of the first opening and a second side surface of the second opening, and
- the second conductive layer being in contact with the semiconductor layer between the first side surface and the first conductive layer.
Dependencies are inferred from the claim text.