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US 10,371,909 B2Granted
Thermal interface
AssigneeFinisar Corporation
InventorsTroy Wy Piew Chiang, Julia Koh, Tat Ming Teo, William H. Wang
Life of this patent
Estimating the term…
Abstract
A thermal interface may include a thermally conductive cap. The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings.
Claims19
An optoelectronic module comprising:
- a shell including a seat;
- an optical subassembly including a header having a plurality of leads;
- a thermal interface comprising:
- a thermally conductive cap including:
- a base defining a plurality of cap openings, the base having a substantially circular shape;
- a plurality of fingers extending from the base;
- and
- an extension extending from an edge of the base, the extension including a curved shape substantially corresponding to a circumferential portion of the base, the extension having a length greater than a length of the plurality of fingers;
- a gasket defining a plurality of gasket openings smaller than the cap openings, the gasket located on the base of the cap such that the gasket openings are positioned over the cap openings, wherein the cap is positioned on the header of the optical subassembly such that the leads are located within the cap openings and the gasket openings, and the extension of the cap is positioned within the seat of the shell;
- an adhesive located between the gasket and the base of the cap;
- and
- a pad located between the seat of the shell and the extension of the cap, the pad including a pliant thermal interface material.
9 more elements
Dependencies are inferred from the claim text.