Integrated circuit with dielectric waveguide connector using photonic bandgap structure

A method, comprising:

• attaching an integrated circuit (IC) die to a leadframe, the IC die including a radio frequency (RF) circuit to send and/or receive an RF signal having a frequency;
• and
• encapsulating the IC die to form an encapsulated package including a photonic structure within an encapsulation material, the photonic structure forming a photonic waveguide that couples to the RF circuit and extends to an external surface of the encapsulated package, the photonic structure being:
• a photonic bandgap structure having a stop band that includes the frequency;
• or a photonic resonant structure having a pass band that includes the frequency.

A device, comprising:

• an integrated circuit including a radio frequency (RF) circuit;
• a photonic bandgap (PBG) waveguide coupled to the RF circuit, the PBG waveguide including a multilayer PBG structure, the multilayer PBG structure including at least first and second layers in which:
• the first layer has a first photonic bandgap with a first frequency range;
• and the second layer has a second photonic bandgap with a second frequency range;
• and
• encapsulation material encapsulating the integrated circuit and the PBG waveguide, the PBG waveguide extending to a surface of the encapsulation material.