3D chip testing through micro-C4 interface

A method, comprising:

• assigning an electrical test signal to a pattern of micro-solder connections formed on a first surface of an IC chip, wherein a center of an individual micro-solder connection in the pattern is separated from a center of another individual micro-solder connection by a distance of approximately 62 μm;
• providing power to the pattern of micro-solder connections for electrical testing from a second surface located on an opposite side of the IC chip using a through substrate via (TSV), wherein the pattern of micro-solder connections comprises:
• the TSV;
• a center micro-solder connection centered on the TSV;
• and
• six (6) micro-solder connections on the first surface positioned around the TSV in a hexagonal pattern, wherein two (2) micro-solder connections are formed on the first surface adjacent to a top side of the TSV, one (1) micro-solder connection is formed on the first surface adjacent to a left side of the TSV, one (1) micro-solder connection is formed on the first surface adjacent to a right side of the TSV, and two (2) micro-solder connections are formed on the first surface adjacent to a bottom side the TSV;
• and
• testing the IC chip using electrical probing by contacting the pattern of micro-solder connections directly with a contact point of a single electrical testing probe tip, said single electrical probe tip comprising:
• a circular base;
• and
• a single circular shaped raised contact point centered on the circular base, wherein the raised contact point has a width or diameter less than a width or diameter of the circular base.