Prepreg, metal-clad laminated plate, wiring board, and method for measuring thermal stress of wiring board material
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsKeiko Kashihara, Hiroharu Inoue, Shingo Yoshioka, Takashi Hoshi
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Abstract
A prepreg includes a resin layer constituted by a half-cured product of a thermosetting resin composition, and a fibrous substrate provided in the resin layer. A prepreg test piece that is a cured product obtained by heat curing the thermosetting resin composition has a maximum value of 400 kPa or less for thermal shrinkage stress measured by a predetermined thermal stress test.
Claims11
A prepreg comprising
- a resin layer constituted by a half-cured product of a thermosetting resin composition, and
- a fibrous substrate provided in the resin layer,
- wherein a maximum value of thermal shrinkage stress of 400 kPa or less is measured during a thermal shrinkage test of a test piece of the prepreg,
- the test piece being a cured product obtained by heat curing the thermosetting resin composition and having a thickness of 0.1 mm,
- the thermal shrinkage stress being obtained by holding the prepreg test piece at both ends by jigs and measuring, as the thermal shrinkage stress, tensile stress between the jigs, and the tensile stress being measured during a period in which a temperature of the prepreg test piece is lowered from 260° C. to normal temperature after the prepreg test piece is heated to a temperature of 260° C. while a distance between the jigs is changed in a range from 0.01 ppm/° C. to 5 ppm/° C., inclusive, by allowing the jigs to come closer to each other.
A prepreg comprising
- a resin layer constituted by a half-cured product of a thermosetting resin composition, and
- a fibrous substrate provided in the resin layer,
- wherein a maximum value of thermal expansion stress of 100 kPa or less is measured during a thermal shrinkage test of a test piece of the prepreg,
- the test piece being a cured product obtained by heat curing the thermosetting resin composition and having a thickness of 0.1 mm,
- the thermal expansion stress being obtained by holding the prepreg test piece at both ends by jigs and measuring, as the thermal expansion stress, tensile stress between the jigs, and the tensile stress being measured during a period in which a temperature of the prepreg test piece is raised from normal temperature to 260° C. while a distance between the jigs is changed in a range from 0.01 ppm/° C. to 5 ppm/° C., inclusive, by allowing the jigs to separate from each other.
A method for measuring thermal stress of a wiring board material, the method comprising:
- holding both ends of a test piece constituted by the wiring board material by jigs, respectively, and
- measuring tensile stress between the jigs which is defined as thermal shrinkage stress, the tensile stress being measured during a period in which a temperature of the test piece is lowered from 260° C. to normal temperature after the test piece is heated to a temperature of 260° C. while a distance between the jigs is changed in a range from 0.01 ppm/° C. to 5 ppm/° C., inclusive, by allowing the jigs to come closer to each other.
A method for measuring thermal stress of a wiring board material, the method comprising:
- holding both ends of a test piece constituted by the wiring board material by jigs, respectively, and
- measuring tensile stress between the jigs which is defined as thermal expansion stress, the tensile stress being measured during a period in which a temperature of the test piece is raised from normal temperature to 260° C. while a distance between the jigs is changed in a range from 0.01 ppm/° C. to 5 ppm/° C., inclusive, by allowing the jigs to separate from each other.
Dependencies are inferred from the claim text.