Shape measurement method and shape measurement device
AssigneeKobelco Research Institute, Inc.
InventorsHidehisa Hashizume, Shunsuke Takami, Norihisa Harano
Life of this patent
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Abstract
A measurement unit measures a cross-sectional shape of an edge part of a semiconductor wafer. The measurement unit measures a cross-sectional shape of an edge part of a support member. The measurement unit measures a cross-sectional shape of an edge part of a laminated wafer. An analysis unit calculates a thickness of an adhesive agent by subtracting a thickness of the semiconductor wafer and a thickness of the support member from a thickness of the laminated wafer.
Claims7
A shape measurement method for measuring a cross-sectional shape of an edge part of a laminated wafer that includes:
- a semiconductor wafer;
- a support member for reinforcing the semiconductor wafer;
- and an adhesive agent for laminating the semiconductor wafer and the support member to each other, the method comprising:
- a first measurement step of individually measuring a cross-sectional shape of an edge part of the semiconductor wafer before lamination and a cross-sectional shape of an edge part of the support member before lamination;
- a second measurement step of measuring the cross-sectional shape of the edge part of the laminated wafer;
- and
- a calculation step of calculating a thickness of the adhesive agent in the laminated wafer by comparing a measurement result of the first measurement step with a measurement result of the second measurement step.
A shape measurement device for measuring a cross-sectional shape of an edge part of a laminated wafer including:
- a semiconductor wafer;
- a support member for reinforcing the semiconductor wafer;
- and an adhesive agent for laminating the semiconductor wafer and the support member to each other, the shape measurement device comprising:
- a measurement unit that individually measures a cross-sectional shape of an edge part of the semiconductor wafer before lamination, a cross-sectional shape of an edge part of the support member before lamination, and the cross-sectional shape of the edge part of the laminated wafer;
- and
- a calculation unit that calculates a thickness of the adhesive agent which forms the laminated wafer, by performing a comparison among a measurement result of the cross-sectional shape of the edge part of the semiconductor wafer before lamination, a measurement result of the cross-sectional shape of the edge part of the support member before lamination, and a measurement result of the cross-sectional shape of the edge part of the laminated wafer.
Dependencies are inferred from the claim text.