Co-extruded microchannel heat pipes

A microchannel heat pipe disposed on a substrate, the microchannel heat pipe comprising:

• an elongated pipe body including first and second elongated side wall portions that are disposed on a surface of the substrate and separated by an elongated central channel, and an upper wall portion extending between said first and second elongated side wall portions over the elongated central channel, whereby the elongated central channel is defined by the first and second elongated side wall portions, the upper wall portion and a portion of the substrate surface extending between said first and second elongated side portions;
• and
• a working fluid encapsulated inside the elongated central channel,
• wherein the first and second elongated side wall portions and the upper wall portion comprise a polymer structure consisting of a hardened extruded polymer material.

A device comprising:

• a substrate having an upper surface;
• a heat generating region formed in the substrate;
• and
• a microchannel heat pipe disposed on the substrate, the microchannel heat pipe including:
• an elongated pipe body including first and second elongated side wall portions that are disposed on a surface of the substrate and separated by an elongated central channel, and an upper wall portion extending between said first and second elongated side wall portions over the elongated central channel, whereby the elongated central channel is defined by the first and second elongated side wall portions, the upper wall portion and a portion of the substrate surface extending between said first and second elongated side portions;
• and
• a working fluid encapsulated inside the elongated central channel,
• wherein the pipe body comprises at least one of a hardened paste and a hardened ink including one or more of silver, copper, nickel, tin, aluminum, steel, alumina, silicates, glasses, carbon black, polymers and wax, and
• wherein the elongated pipe body is disposed on the substrate such that the heat generating region is disposed under a first end of the microchannel heat pipe, and a second end of the microchannel heat pipe is disposed adjacent to a heat sink region of the device that is spaced from the heat generating region.