Multi-layered counterflow expanding microchannel cooling architecture and system thereof

A device, comprising:

• a first manifold having a first cooling channel, wherein a width of the first cooling channel increases linearly from an inlet channel of the first manifold to an outlet channel of the first manifold, wherein the inlet channel is located on a first side of a heat transfer area at a first edge of the first manifold and the outlet channel is located on a second side of the heat transfer area at a second edge of the first manifold, wherein the first side is opposite the second side;
• a second manifold having a second cooling channel, wherein a width of the second cooling channel increases as the second cooling channel increases linearly from a second inlet channel to a second outlet channel, wherein a fluid that feeds through the first cooling channel is in a counter flow direction from the fluid through the second cooling channel;
• and
• wherein the first manifold traverses a first plane and the second manifold traverses a second plane, and wherein the first plane is parallel to the second plane.

A system, comprising:

• a pump that propels a fluid into a manifold device, wherein the manifold device comprises:
• a plate having an inlet port;
• a first manifold having a first inlet channel that receives fluid from the inlet port and outputs the fluid to a first cooling channel, wherein a width of the first cooling channel increases linearly from the first inlet channel to an outlet channel on the first manifold and
• a second manifold having a second inlet channel that receives the fluid and outputs the fluid to a second cooling channel, wherein a width of the second cooling channel increases from the second inlet channel to a second outlet channel, wherein the first inlet channel is located at a first side of a heat transfer area and the second inlet channel is located at a second side of the heat transfer area, wherein the first side of the heat transfer area is opposite the second side of the heat transfer area;
• and
• a reservoir that collects the fluid exiting the manifold device;
• a plate having an inlet port;
• a first structure adjacent the plate and having a first inlet channel that receives fluid from the inlet port and feeds a first cooling channel, wherein a width of the first cooling channel increases linearly from the first inlet channel to an outlet channel on the first structure;
• and
• a second structure adjacent the first structure and having a second inlet channel that receives the fluid from the inlet port and feeds a second cooling channel, wherein a width of the second cooling channel increases linearly from the second inlet channel to a second outlet channel, wherein the first outlet channel is located at a first side of a heat transfer area of the device and the second outlet channel is located at a second side of the heat transfer area, wherein the first side is opposite the second side.