Thin substrate processing device

A substrate processing device comprising:

• a processing chamber;
• a transporting unit arranged in the processing chamber;
• and
• an inverting chamber connected to the processing chamber to allow the transporting unit to transport a substrate, wherein
• the processing chamber includes:
• a substrate processing unit configured to process the substrate;
• a cooling unit configured to cool the substrate when the substrate processing unit is processing the substrate;
• and
• a position changing unit configured to change a position of the cooling unit relative to the substrate located at a processing position at which the substrate is processed by the substrate processing unit,
• the transporting unit is configured to transport the substrate between the processing position and a non-processing position, at which the substrate is not processed by the substrate processing unit, while supporting a lower end of the substrate in an upright state of the substrate,
• the position changing unit is configured to change the position of the cooling unit between a contact position at which the cooling unit contacts the substrate and a non-contact position at which the cooling unit does not contact the substrate,
• the transporting unit is configured to transport the substrate when the cooling unit is located at the non-contact position,
• the inverting chamber includes a substrate rotating unit having a mounting section on which the substrate of the upright state is mounted, wherein the substrate rotating unit is configured to rotate the mounting section around an axis which is orthogonal to a bottom wall of the inverting chamber;
• and
• the substrate processing device is configured to process one surface of the substrate in the processing chamber, turn the substrate by 180° in the inverting chamber after the one surface of the substrate is processed, and process the other surface of the substrate in the processing chamber.