Cleaner composition and preparation of thin substrate
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsMasaya Ueno, Hideyoshi Yanagisawa
Life of this patent
Estimating the term…
Abstract
A cleaner composition consisting essentially of (A) 92.0 wt % to less than 99.9 wt % of an organic solvent, (B) 0.1 wt % to less than 8.0 wt % of a C3-C6 alcohol, and (C) 0.001-3.0 wt % of a quaternary ammonium salt is effective for removing any silicone adhesive residues on a silicon semiconductor substrate. A satisfactory degree of cleanness is achieved within a short time and at a high efficiency without causing corrosion to the substrate.
Claims7
A cleaner composition for removing any silicone adhesive remaining on a substrate, consisting essentially of
- (A) 92.0% to less than 99.9% by weight of an organic solvent exclusive of an alcohol of 3 to 6 carbon atoms,
- (B) 0.1% to less than 8.0% by weight of an alcohol of 3 to 6 carbon atoms, and
- (C) 0.001% to 3.0% by weight of a quaternary ammonium salt, the total amount of components (A) to (C) being 100% by weight,
- wherein the organic solvent (A) is one or two more kinds selected from the group consisting of octane, nonane, decane, undecane, dodecane, tetradecane, hexadecane, isooctane, isononane, isodecane, isododecane, alkylcyclohexanes, p-menthane, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dibutyl ether and dipropylene glycol dimethyl ether, and
- the alcohol (B) is one or two more kinds selected from the group consisting of n-propyl alcohol, isopropyl alcohol, 1-butanol, 2-butanol, isobutyl alcohol, tert-butyl alcohol, 1-pentanol, 2-pentanol, 3-pentanol, 2-methyl-1-butanol, isopentyl alcohol, sec-butyl alcohol, tert-pentyl alcohol, 3-methyl-2-butanol, neopentyl alcohol, 1-hexanol, 2-methyl-1-pentanol, 4-methyl-2-pentanol and 2-ethyl-1-butanol and the cleaning composition is free of water.
A method for preparing a thin substrate, comprising the steps of
- (a) forming an adhesive layer on a substrate or handle substrate from an adhesive composition and bonding the substrate and the handle substrate via the adhesive layer,
- (b) processing the substrate bonded to the handle substrate,
- (c) separating the substrate as processed from the handle substrate, the adhesive layer remaining on the substrate after separation, and
- (d) cleaning away the adhesive layer on the substrate with the cleaner composition, wherein the cleaner composition consisting essentially of
- (A) 92.0% to less than 99.9% by weight of an organic solvent exclusive of an alcohol of 3 to 6 carbon atoms,
- (B) 0.1% to less than 8.0% by weight of an alcohol of 3 to 6 carbon atoms, and
- (C) 0.001% to 3.0% by weight of a quaternary ammonium salt, the total amount of components (A) to (C) being 100% by weight,
- wherein the organic solvent (A) is one or two more kinds selected from the group consisting of octane, nonane, decane, undecane, dodecane, tetradecane, hexadecane, isooctane, isononane, isodecane, isododecane, alkylcyclohexanes, p-menthane, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dibutyl ether and dipropylene glycol dimethyl ether, and
- the alcohol (B) is one or two more kinds selected from the group consisting of n-propyl alcohol, isopropyl alcohol, 1-butanol, 2-butanol, isobutyl alcohol, tert-butyl alcohol, 1-pentanol, 2-pentanol, 3-pentanol, 2-methyl-1-butanol, isopentyl alcohol, sec-butyl alcohol, tert-pentyl alcohol, 3-methyl-2-butanol, neopentyl alcohol, 1-hexanol, 2-methyl-1-pentanol, 4-methyl-2-pentanol and 2-ethyl-1-butanol and the cleaning composition is free of water.
Dependencies are inferred from the claim text.