Easily deformable aggregate and method for manufacturing same, thermally conductive resin composition, thermally conductive member and method for manufacturing same, and thermally conductive adhesive sheet

A thermally-conductive, electrically-insulating member (H) manufactured by a manufacturing method, the thermally-conductive electrically-insulating member (H) comprising a thermally conductive layer comprising:

• (1) 20 to 90 vol. % of an easily deformable aggregate (D) comprising:
• (i) 100 pts·mass of thermally-conductive, electrically-insulating particles (A) having an average primary particle diameter of 0.1 to 10 μm;
• and
• (ii) 0.1 to 30 pts·mass of an organic binding agent (B) not including a silane coupling agent,
• wherein the easily deformable aggregate (D) has an average particle diameter of 2 to 100 μm, and an average compressive force required for a 10% compressive deformation rate is 5 mN or lower;
• and
• (2) 10 to 80 vol. % of a binder resin (E),
• the manufacturing method comprising:
• a step of obtaining a slurry comprising 100 pts·mass of thermally-conductive, electrically-insulating particles (A) having an average primary particle diameter of 0.1 to 10 μm, 0.1 to 30 pts·mass of an organic binding agent (B), and a solvent (C) that dissolves the agent (B);
• a step of removing the solvent (C) from the obtained slurry to obtain an easily deformable aggregate (D);
• a step of preparing a thermally conductive resin composite (G) comprising an easily deformable aggregates (D), a binder resin (E);
• and a solvent (F) that dissolves the binder resin (E);
• a step of applying the thermally conductive resin composition (G) on a base material and thereby forming a coating;
• and
• a step of removing the solvent (F) from the coating and thereby forming a thermally conductive layer.