Moisture-curable hot melt silicone adhesive compositions including an alkoxy-functional siloxane reactive resin

A method for forming a moisture-curable hot melt adhesive composition, the method comprising:

• (a) forming a reactive resin comprising a hydrosilylation reaction product of a reaction of:
• an alkenyl-functional siloxane resin comprising R3SiO1/2 units and SiO4/2 units, wherein each R is independently a monovalent hydrocarbon radical having 1 to 6 carbon atoms with the proviso that at least one R is an alkenyl radical, wherein the molar ratio of the R3SiO1/2 units to SiO4/2 units has a value of from 0.5/1 to 1.5/1, and
• a first alkoxysilane-functional organosiloxane compound of the formula HSi(R2)2OSi(R2)2CH2CH2SiR2z(OR2)3-z, wherein each R2 is independently a monovalent hydrocarbon having 1 to 2 carbon atoms and wherein the subscript z is 0 or 1,
• in the presence of a first hydrosilylation catalyst;
• (b) providing a (trimethoxysilylethyl)tetramethyldisiloxane-terminated polydimethylsiloxane having a viscosity of from 500 to 60,000 cps as a reactive polymer;
• (c) mixing the reactive resin and the reactive polymer to form a first mixture;
• (d) heating the first mixture to a temperature ranging from 140° C. to 180° C. and extruding the mixture through a first extruder to form an extruded mixture;
• (e) cooling the extruded mixture to a temperature below 95° C. to provide a cooled extruded mixture;
• (f) introducing and mixing a moisture cure catalyst and a crosslinker to the cooled extruded mixture to form a second mixture;
• and
• (g) extruding the second mixture through a second extruder to form a moisture-curable hot melt adhesive composition.