Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board

A resin composition comprising:

• a polyphenylene ether (A) having a number average molecular weight of 500 to 5000 and comprising a compound represented by the following formula (4):
• wherein X represents a group represented by the following formula (5) or the following formula (6), Y each independently represents a group represented by the following formula (7), a and b each represent an integer of 0 to 100, and at least either one of a and b is 1 or more,
• wherein R21, R22, R23, R27,and R28 each independently represent an alkyl group having 6 or less carbon atoms or a phenyl group, and R24, R25, and R26 each independently represent a hydrogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group,
• wherein R29, R30, R31, R32, R33, R34, R35, and R36 each independently represent a hydrogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group, and A represents a linear, branched, or cyclic divalent hydrocarbon group having 20 or less carbon atoms,
• wherein R39 and R40 each independently represent an alkyl group having 6 or less carbon atoms or a phenyl group, and R37 and R38 each independently represent a hydrogen atom, an alkyl group having 6 or less carbon atoms, or a phenyl group;
• a cyclophosphazene compound (B) represented by the following formula (13);
• a non-halogen-based epoxy resin (C);
• a cyanate compound (D);
• and
• a filler (E),
• wherein Z1 and Z2 each independently represents a vinyl group or a hydrogen atom, at least either one of Z1 and Z2 is a vinyl group, and n represents an integer of 3 to 8 and
• wherein a ratio of the vinyl group equivalent of the cyclophosphazene compound (B) to the vinyl group equivalent of the polyphenylene ether (A) is from 0.2 to 4.