Curable polysilsesquioxane compound, production method thereof, curable composition, cured product and use method of curable composition
AssigneeLintec Corporation
InventorsMasami Matsui, Mikihiro Kashio
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AssigneeLintec Corporation
InventorsMasami Matsui, Mikihiro Kashio
Estimating the term…
The present invention is a curable polysilsesquioxane compound comprising at least one structural unit represented by CHR1X0-D-SiO3/2, the curable polysilsesquioxane compound having a 29Si nuclear magnetic resonance spectrum that has a first peak top within a range of −73 ppm or more and less than −65 ppm, has a second peak top within a range of −82 ppm or more and less than −73 ppm, and substantially does not have a peak within a range of −65 ppm or more and less than −55 ppm, and a method for producing the curable polysilsesquioxane compound, and a curable composition comprising the curable polysilsesquioxane compound and a silane coupling agent, and a cured product obtained by heating the curable composition, and a method for using the curable polysilsesquioxane compound or the curable composition, as an optical device-securing material.
A curable polysilsesquioxane compound comprising at least one structural unit represented by CHR1X0-D-SiO3/2, wherein R1 is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, X0 is a cyano group, or a group represented by OG (wherein G is a protecting group for a hydroxyl group), and D is a single bond, or a substituted or unsubstituted divalent organic group having 1 to 20 carbon atoms,
A curable polysilsesquioxane compound comprising at least one structural unit represented by CHR1X0-D-SiO3/2, wherein R1 is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, X0 is a cyano group, or a group represented by OG (wherein G is a protecting group for a hydroxyl group), and D is a single bond, or a substituted or unsubstituted divalent organic group having 1 to 20 carbon atoms,
Dependencies are inferred from the claim text.