Polyamic acid resin, polyamideimide film, and method for preparing the same
AssigneeSK Innovation Co., Ltd.
InventorsSang Yoon Park, Hyeon Jeong Kim, Tae Sug Jang, Jin Hyung Park
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Abstract
Provided are a polyamic acid resin, a polyamideimide film, and a method for preparing the same. More specifically, provided are a polyamic acid resin derived from a combination of specific components, a polyamideimide film capable of implementing high modulus and excellent optical properties while implementing excellent mechanical properties, heat properties, and electrical properties, and a method for preparing the same.
Claims15
A polyamideimide film comprising:
- a polyamideimide resin derived from an aromatic diamine including:
- 2,2′-bis(trifluoromethyl)benzidine;
- a cycloaliphatic dianhydride;
- and
- an aromatic diacid dichloride consisting of isophthaloyl dichloride (IPC) and terephthaloyl dichloride (TPC).
A method for preparing a polyamideimide film comprising:
- (a) preparing a polyamic acid solution by dissolving aromatic diamine containing 2,2′-bis(trifluoromethyl)benzidine in an organic solvent, and adding and reacting cycloaliphatic dianhydride and an aromatic diacid dichloride consisting of isophthaloyl dichloride (IPC) and terephthaloyl dichloride (TPC);
- (b) preparing polyamideimide resin by imidization of the polyamic acid solution;
- and
- (c) applying a polyamideimide solution in which the polyamideimide resin is dissolved in the organic solvent.
A polyamic acid resin derived from aromatic diamine including 2,2′-bis(trifluoromethyl)benzidine, a cycloaliphatic dianhydride, and an aromatic diacid dichloride consisting of isophthaloyl dichloride (IPC) and terephthaloyl dichloride (TPC).
Dependencies are inferred from the claim text.