Process for producing bonded body and process for producing power module substrate
AssigneeMitsubishi Materials Corporation
InventorsNobuyuki Terasaki, Yoshiyuki Nagatomo
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Abstract
Disclosed is provided a process for producing a bonded body by bonding a ceramic member made of a ceramic to a Cu member made of Cu or a Cu alloy, the process including: a laminating step of laminating the Cu member on a first surface side of the ceramic member via a brazing material containing Cu and a eutectic element which has a eutectic reaction with Cu, and via an active metal; and a heating step of heating the ceramic member and the Cu member which are laminated together.
Claims12
A process for producing a bonded body by bonding a ceramic member made of a ceramic and a Cu member made of Cu or a Cu alloy together, the process comprising:
- a laminating step of laminating the Cu member on a first surface side of the ceramic member via a brazing material consisting of Cu and a eutectic element which has a eutectic reaction with Cu, and via an active metal;
- and
- a heating step of heating the ceramic member and the Cu member which are laminated together,
- wherein the eutectic element is one element or two or more elements selected from Ca, Ge, Sr, Sn, Sb, Ba, La, Ce, and Al.
Dependencies are inferred from the claim text.