Layer structure and method of manufacturing a layer structure

An array, comprising a plurality of layer structures, wherein the layer structure comprises,

• a carrier;
• a two-dimensional layer comprising a first surface facing away from the carrier, a second surface opposite the first surface facing towards the carrier, and an edge surface;
• and
• a holding structure;
• wherein the holding structure is arranged on the carrier and holds the two-dimensional layer such that at the second surface of the two-dimensional layer is free of the holding structure and is spaced apart from the carrier thereby forming an empty space between the carrier and the second of the two-dimensional layer;
• wherein the holding structure comprises a holding portion disposed beyond the edge surface of the two-dimensional layer such that the holding portion is not in contact with the second surface of the two-dimensional layer and spans a distance between the carrier and the second surface of the two-dimensional layer;
• wherein the holding structure comprises a contact portion contacting the first surface of the two-dimensional layer;
• wherein the holding structure comprises a holding pillar comprising the contact portion and the holding portion;
• and
• wherein the holding pillar is at least partially made of an electrically conductive material.

A layer structure, comprising:

• a carrier;
• a two-dimensional layer comprises a first surface facing away from the carrier, a second surface opposite the first surface towards the carrier, and an edge surface;
• and
• a holding structure;
• wherein the holding structure is arranged on the carrier and holds the two-dimensional layer such that the first surface of the two-dimensional layer is in contact with the holding structure and the second surface of the two-dimensional layer is free of the holding structure and the two-dimensional layer is spaced apart from the carrier thereby forming an empty space between the carrier and the second surface of the two-dimensional layer;
• wherein the holding structure comprises at least two holding members being in physical contact with each other and having different thermal expansion characteristics;
• wherein each of the at least two holding members comprises an inward surface facing towards the empty space and an outward surface opposite the inward surface facing away from the empty space;
• and
• wherein the outward surface of one of the at least two holding members is in physical contact with the inward surface of another one of the at least two holding members.

An array, comprising a plurality of layer structures, wherein the layer structure comprises:

• a carrier;
• a two-dimensional layer comprising a first surface facing away from the carrier, a second surface opposite the first surface facing towards the carrier, and an edge surface;
• and
• a holding structure;
• wherein the holding structure is arranged on the carrier and holds the two-dimensional layer such that the first surface of the two-dimensional layer is in contact with the holding structure and the second surface of the two-dimensional layer is free of the holding structure and the two-dimensional layer spaced apart from the carrier thereby forming an empty space between the carrier and the second surface of the two-dimensional layer;
• wherein the holding structure comprises at least two holding members being in physical contact with each other and having different thermal expansion characteristics;
• wherein each of the at least two holding members comprises an inward surface facing towards the empty space and an outward surface opposite the inward surface facing away from the empty space;
• and
• wherein the outward surface of one of the at least two holding members is in physical contact with the inward surface of another one of the at least two holding members.

A layer structure, comprising:

• a carrier;
• a two-dimensional layer;
• and
• a holding structure;
• wherein the two-dimensional layer comprises a first surface facing away from the carrier, a second surface opposite the first surface facing towards the carrier, and an edge surface at the perimeter of the two-dimensional layer;
• wherein the holding structure is arranged on the carrier and holds the two-dimensional layer such that the second surface of the two-dimensional layer is free of the holding structure and is spaced apart from the carrier thereby forming an empty space between the carrier and the second surface of the two-dimensional layer;
• wherein the holding structure comprises a plurality of holding pillars evenly arranged around the perimeter of the two-dimensional layer, each holding pillar comprising a holding portion and a contact portion;
• wherein the holding portion is arranged on the carrier beyond the edge surface of the two-dimensional layer so that the holding portion is not under the two-dimensional layer, the holding portion spans at least a distance of the empty space between the carrier and the second surface of the two-dimensional layer;
• wherein the contact portion contacts the edge surface and the first surface of the two-dimensional layer;
• wherein each holding pillar comprises a first holding member and a second holding member where the thermal expansion characteristics of the first holding member is different from the thermal expansion characteristics of the second holding member;
• wherein each of the at least two holding members comprises and inward surface facing towards the empty space and an outward surface opposite the inward surface facing away from the empty space;
• wherein the outward surface of the first holding member is in physical contact with the inward surface of the second holding member;
• wherein the first holding ,member ,comprises the ,contact portion;
• and wherein the first holding member comprises an electrically conductive material.