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US 10,369,793 B2Granted
Service structures in print heads
AssigneeHewlett-Packard Development Company, L.P.
InventorsDevin Alexander Mourey, Chien-Hua Chen, Michael W. Cumbie
Life of this patent
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Abstract
In example implementations, an apparatus with an embedded service structure is provided. The apparatus may include an epoxy molded compound (EMC). At least one print head die may be embedded in the EMC. A service structure may be located within the EMC adjacent to the at least one print head die.
Claims20
An apparatus, comprising:
- an epoxy molded compound (EMC);
- at least one print head die embedded in the EMC;
- and
- a service structure within the EMC located adjacent to the at least one print head die.
1 more element
A method, comprising:
- providing a structured carrier having a service structure;
- applying a thermal release tape over the structured carrier;
- applying at least one print head die on the thermal release tape;
- encapsulating the at least one print head die and an area that includes the service structure with an epoxy molding compound (EMC);
- and
- removing the structured carrier and the thermal release tape,
- wherein the service structure is transferred to the EMC as an embedded service structure, wherein the embedded service structure is adjacent to the at least one print head die.
4 more elements
A method, comprising:
- providing a structured carrier;
- applying a thermal release tape over the structured carrier;
- applying at least one print head die on the thermal release tape;
- applying a service structure on the thermal release tape adjacent to the at least one print head die;
- encapsulating the at least one print head die and the service structure with an epoxy molding compound (EMC);
- and
- removing the structured carrier and the thermal release tape to form an embedded service structure adjacent to the at least one print head die.
4 more elements
Dependencies are inferred from the claim text.