Thermally conductive de-bonding aid

A method of disassembling a computing device display comprising:

• providing a mask oriented between a cover glass and a chassis and extending about an entire perimeter of the display;
• conducting thermal energy through the cover glass to a thermally conductive de-bonding aid including passive thermally conductive portions of the mask located in multiple discrete sections of the perimeter of the display spaced apart from a sensitive component mounted within the display, wherein the thermally conductive de-bonding aid heats a thermally sensitive adhesive also oriented between the cover glass and the chassis and extending about the entire perimeter of the display;
• and
• lifting the cover glass from the chassis.

A computing device display comprising:

• a chassis;
• a cover glass;
• a thermally sensitive adhesive oriented between the cover glass and the chassis and extending about an entire perimeter of the display;
• a passive array of thermally conductive de-bonding pads also oriented between the cover glass and the chassis and located in multiple discrete sections of the perimeter of the display spaced apart from a sensitive component mounted within the display;
• and
• an active de-bonding aid also oriented between the cover glass and the chassis and located in one or more other discrete sections of the perimeter of the display also spaced apart from the sensitive component mounted within the display, the active de-bonding aid to apply thermal energy to the computing device display and the passive array to direct thermal energy away from the sensitive component and toward the thermally sensitive adhesive.