CMP apparatus having polishing pad surface property measuring device

A CMP apparatus comprising:

• a polishing pad surface property measuring device configured to apply a laser beam to a surface of a polishing pad and to receive reflected light from the polishing pad to obtain reflection intensity in a reflection angle;
• a processor configured to perform a Fourier transform on a reflection intensity distribution obtained by the polishing pad surface property measuring device to obtain a spatial wavelength spectrum of the surface of the polishing pad, and to perform numerical analysis on the spatial wavelength spectrum to obtain surface properties of the polishing pad;
• and
• an abnormality judgement unit configured to judge an abnormality of the surface properties of the polishing pad when a surface property value of the polishing pad obtained by the processor is compared with a preset range of the surface property value of the pad and falls outside the preset range;
• wherein the polishing pad surface property measuring device comprises a laser light source, a light emitter and a light receiver;
• and
• wherein the polishing pad surface property measuring device further comprises at least one of a mirror, an ND filter, a polarizer, a bandpass filter which allows transmission of only light within ±5 nm with respect to a wavelength of the laser beam emitted from the laser light source, and an optical fiber.

A CMP apparatus comprising:

• a polishing pad surface property measuring device configured to apply a laser beam to a surface of a polishing pad and to receive reflected light from the polishing pad to obtain at least one reflection intensity at a reflection angle;
• a processor configured to perform a Fourier transform on a reflection intensity distribution obtained by the polishing pad surface property measuring device to obtain a spatial wavelength spectrum of the surface of the polishing pad, and to perform numerical analysis on the spatial wavelength spectrum to obtain surface properties of the polishing pad;
• and
• a display unit configured to display at least one of a state of a dresser and a state of the polishing pad based on a result of comparison between the surface properties of the polishing pad and a preset surface property value of the pad;
• wherein the polishing pad surface property measuring device comprises a laser light source, a light emitter and a light receiver;
• and
• wherein the polishing pad surface property measuring device further comprises at least one of a mirror, an ND filter, a polarizer, a bandpass filter which allows transmission of only light within ±5 nm with respect to a wavelength of the laser beam emitted from the laser light source, and an optical fiber.

A CMP apparatus comprising:

• a polishing pad surface property measuring device configured to apply a laser beam to a surface of a polishing pad and to receive reflected light from the polishing pad to obtain reflection intensity in a reflection angle;
• a processor configured to perform a Fourier transform on a reflection intensity distribution obtained by the polishing pad surface property measuring device to obtain a spatial wavelength spectrum of the surface of the polishing pad, and to perform numerical analysis on the spatial wavelength spectrum to obtain surface properties of the polishing pad;
• and
• a display unit configured to display at least one of a state of a dresser and a state of the polishing pad based on the surface properties of the polishing pad;
• wherein the polishing pad surface property measuring device comprises a laser light source, a light emitter and a light receiver;
• and
• wherein the polishing pad surface property measuring device further comprises at least one of a mirror, an ND filter, a polarizer, a bandpass filter which allows transmission of only light within ±5 nm with respect to a wavelength of the laser beam emitted from the laser light source, and an optical fiber.