Process for producing sputtering target and sputtering target
AssigneeSumitomo Chemical Company, Limited
InventorsMikio Takigawa, Toshiyuki Terasawa
Life of this patent
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Abstract
A process for producing a sputtering target in which a target material is diffusion-bonded to a top face of a backing plate material, the process comprising: a step of heating the top face of the target material by a hot plate while pressing from above thereby diffusion-bonding the target material to the backing plate material in such a manner that the step is performed at a center part prior to an outer peripheral part of the top face.
Claims10
A process for producing a sputtering target in which a target material is diffusion-bonded to a top face of a backing plate material,
- which process comprises heating the top face of the target material by a hot plate at a center part prior to an outer peripheral part of the top face while pressing from above to perform diffusion-bonding of the target material to the backing plate material,
- said target material having hardness smaller than the backing plate material.
A process for producing a sputtering target in which a target material is diffusion-bonded to a top face of a backing plate material,
- which process comprises heating the target material by a hot plate at a center part of an opposite face to a face in contact with the backing plate material prior to an outer peripheral part of the opposite face while pressing from a uniaxial direction to perform diffusion-bonding of the target material to the backing plate material,
- said target material having hardness smaller than the backing plate material.
Dependencies are inferred from the claim text.