Electrospun three-dimensional nanofibrous scaffolds with interconnected and hierarchically structured pores
AssigneeSouth Dakota Board of Regents
InventorsHao Fong, Tao Xu, Yong Zhao, Todd J. Menkhaus
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AssigneeSouth Dakota Board of Regents
InventorsHao Fong, Tao Xu, Yong Zhao, Todd J. Menkhaus
Estimating the term…
The invention relates to electrospun three-dimensional (3D) nanofibrous scaffolds (with controllable porosities as high as about 96%) and methods of preparing the same. The electrospun 3D scaffolds possess interconnected and hierarchically structured pores with sizes ranging from tens of nanometers to hundreds of micrometers. In embodiments, the 3D scaffolds can be biocompatible and/or biodegradable. In some embodiments, the 3D scaffolds can be conductive. In some embodiments, the 3D scaffolds can contain bioactive species.
A method for preparing a three-dimensional nanofibrous scaffold comprising:
Dependencies are inferred from the claim text.