Ultrasonic probe
AssigneeSamsung Electronics Co., Ltd.
InventorsKyungil Cho, Jong Keun Song, Seungheun Lee, Baehyung Kim, Youngil Kim
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AssigneeSamsung Electronics Co., Ltd.
InventorsKyungil Cho, Jong Keun Song, Seungheun Lee, Baehyung Kim, Youngil Kim
Estimating the term…
Disclosed herein is an ultrasonic probe configured to release heat generated by a transducer to an exterior of the ultrasonic probe via a heat pipe and a radiator. The ultrasonic probe includes a housing; a transducer configured to generate ultrasonic waves while disposed in an interior of the housing; a heat pipe configured to transfer the heat generated by the transducer; a radiator connected to the heat pipe and configured to release the heat, which is transferred via the heat pipe, to the exterior of the housing; and a partition wall configured to separate an inside space within the housing.
An ultrasonic probe, comprising:
An ultrasonic probe, comprising:
An ultrasonic probe, comprising:
A method for dispersing heat generated by an ultrasonic probe, the ultrasonic probe including a housing and a transducer configured to generate ultrasonic waves, and the method comprising:
Dependencies are inferred from the claim text.