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US 10,368,840 B2Granted
Ultrasonic apparatus
AssigneeSeiko Epson Corporation
InventorsYoshio Arai, Kazuki Yoshida
Life of this patent
Estimating the term…
Abstract
An ultrasonic apparatus includes an ultrasonic element substrate that includes an ultrasonic element array transmitting an ultrasonic wave in a first direction, and a first conductive film provided on the first direction side of the ultrasonic element array, a casing portion that has a conductive member provided to surround the ultrasonic element substrate on a side intersecting the first direction of the ultrasonic element substrate, and a support substrate that is provided on an opposite side to the first direction of the ultrasonic element substrate, supports the ultrasonic element substrate, and has conductivity.
Claims15
An ultrasonic apparatus comprising:
- an ultrasonic element substrate including an ultrasonic element array, the ultrasonic element array transmitting an ultrasonic wave in a first direction;
- a first conductive film provided on a first side of the ultrasonic element substrate in the first direction;
- a protective member provided at the first side of the ultrasonic element substrate;
- a second conductive member provided at a periphery of the protective member on a bottom surface of the protective member, the bottom surface facing the ultrasonic element substrate;
- a case having a conductive member, the conductive member laterally surrounding a side of the ultrasonic element substrate in a second direction intersecting the first direction, the conductive member being a thin film provided on a surface of the case, the case being made of a material having a resin;
- and
- a support substrate that is provided on a second side opposite to the first side in the first direction of the ultrasonic element substrate, the support substrate supporting the ultrasonic element substrate, the support substrate having conductivity,
- wherein the first conductive film, the second conductive film, the conductive member, and the support substrate are electrically connected to each other, and
- the second conductive film is adhered to the conductive member via a conductive adhesive.
6 more elements
An ultrasonic apparatus comprising:
- an ultrasonic element substrate including an ultrasonic element array, the ultrasonic element array transmitting an ultrasonic wave in a first direction;
- a first conductive film provided on a first side of the ultrasonic element substrate in the first direction;
- a second conductive member provided at a periphery of the protective member on a bottom surface of the protective member, the bottom surface facing the ultrasonic element substrate,
- a case having a conductive member, the conductive member laterally surrounding a side of the ultrasonic element substrate in a second direction intersecting the first direction, the conductive member being a thin film provided on a surface of the base, the case being made of a material having a resin;
- a support substrate that is provided on a second side opposite to the first side in the first direction of the ultrasonic element substrate, the support substrate supporting the ultrasonic element substrate, the support substrate having conductivity;
- and
- an electric wave shield for the ultrasonic apparatus is configured with the first conductive film, the second conductive film, the conductive member, and the support substrate to enclose the ultrasonic element array,
- wherein the first conductive film, the second conductive film, the conductive member, and the support substrate are electrically connected to each other, and
- the second conductive film is adhered to the conductive member via a conductive adhesive.
6 more elements
An ultrasonic apparatus comprising:
- an ultrasonic element substrate including an ultrasonic element array, the ultrasonic element array transmitting an ultrasonic wave in a first direction;
- a first conductive film provided on a first side of the ultrasonic element substrate in the first direction;
- a protective member provided at the first side of the ultrasonic element substrate;
- a second conductive member provided at a periphery of the protective member on a bottom surface of the protective member, the bottom surface facing the ultrasonic element substrate;
- a case having a conductive member, the conductive member laterally surrounding a side of the ultrasonic element substrate in a second direction intersecting the first direction, the conductive member being disposed at a second side opposite to the first side in the first direction of the ultrasonic element substrate;
- and
- a support substrate that is provided on the second side of the ultrasonic element substrate, the support substrate support the ultrasonic element substrate, the support substrate having conductivity,
- wherein the first conductive film, the second conductive film, the conductive member, and the support substrate are electrically connected to each other, and
- the second conductive film is adhered to the conductive member via a conductive adhesive.
6 more elements
Dependencies are inferred from the claim text.