Method and system for delivering hydrogen peroxide to a semiconductor processing chamber

A semiconductor processing system for processing semiconductor wafers, comprising:

• a batch processing chamber configured to accommodate 20 or more of the semiconductor wafers;
• a process canister for holding a H2O2/H2O mixture in a liquid state;
• an evaporator provided with an evaporator heater, the evaporator heater configured to heat the evaporator to a temperature lower than 120° C.;
• a first feed line for feeding the liquid H2O2/H2O mixture to the evaporator;
• a second feed line for feeding the evaporated H2O2/H2O mixture to the processing chamber, the second feed line provided with a second feed line heater configured to heat the second feed line to a temperature within 20° C. of the temperature of the evaporator;
• a filter in the second feed line, wherein the second feed line heater is configured to heat the second feed line and the filter to a temperature within 10° C. of the temperature of the evaporator;
• and a controller configured to cause the system to:
• load the 20 or more of the semiconductor wafers into the processing chamber;
• and oxidize the 20 or more of the semiconductor wafers in the processing chamber by flowing the evaporated H2O2/H2O mixture into the processing chamber.