Substrate processing apparatus and substrate processing method

A substrate processing apparatus for processing a substrate having a first surface and a second surface, the second surface being an opposite side of the substrate from the first surface, comprising:

• a scrubber having scrubbing tapes, tape feeding reels configured to feed the scrubbing tapes, tape winding reels configured to wind the scrubbing tapes, and tape winding shafts coupled to the tape winding reels, respectively, the scrubber being configured to bring the scrubbing tapes into contact with the first surface of the substrate while rotating the scrubbing tapes about a central axis of the scrubber, a diameter of a scrubbing surface formed by the rotating scrubbing tapes being equal to or smaller than a radius of the substrate;
• a substrate rotating mechanism configured to rotate the substrate about a rotating axis of the substrate rotating mechanism;
• and
• a hydrostatic support mechanism having a substrate support surface for supporting the second surface of the substrate via fluid pressure without contacting the substrate, the substrate support surface having a diameter smaller than a diameter of the substrate, the scrubbing surface being concentric with the substrate support surface, and the central axis of the scrubber and a center of the substrate support surface being out of alignment with the rotating axis of the substrate rotating mechanism.