Power conversion apparatus

A power conversion apparatus comprising:

• a semiconductor module;
• an electronic component electrically connected to the semiconductor module;
• a cooling member that cools the semiconductor module and the electronic component, the cooling member being laminated with the semiconductor module and the electronic component to form a laminate;
• a casing that accommodates the laminate;
• and
• a pressurizing member that pressurizes the laminate in a lamination direction,
• wherein
• the electronic component includes:
• a load application part that receives a load caused by pressurizing force of the pressurizing member on a surface of the casing adjacent the pressurizing member in the lamination direction;
• a load supporting part that comes into contact with a surface of a contact part of the casing in the lamination direction, the surface of the contact part opposite to the surface of the casing adjacent the pressurizing member;
• and
• a fastening part fastened to a casing fastening part of the casing,
• the load supporting part is disposed between the load application part and the fastening part with respect to the lamination direction;
• a moment of force around the load supporting part is produced in the electronic component by the load applied to the load application part;
• and
• the moment causes the electronic component to be pressed towards a pressed part which constitutes a part of the casing.