Heat sink

A heat sink module comprising:

• at least two processors, each of the at least two processors positioned along a distinct processor seating plane;
• at least two heat sinks, each of the at least two heat sinks formed to mate with one of the at least two processors;
• a mechanical support member that bends in correspondence with a height difference between the first processor and the second processor and formed to mechanically engage with the at least two heat sinks;
• and
• a flexible heat pipe to connect the at least two heat sinks to provide a thermal link therebetween.

A heat sink assembly comprising:

• a first heat sink, formed to mate with a first processor along a first processor seating plane;
• a second heat sink, formed to mate with a second processor along a second processor seating plane;
• a mechanical support member to support the first heat sink and the second heat sink along the first processor seating plane and the second processor seating plane, respectively;
• and
• a flexible heat pipe between the first heat sink and the second heat sink to provide a thermal link therebetween, wherein each of the first and second heat sinks comprises a respective heat sink base, the heat sink base comprising:
• a first portion to make thermal contact with a corresponding one of the first and second processors, and
• a second portion extending past the first portion to engage with the mechanical support member.