Integrated circuit package assembly comprising a stack of slanted integrated circuit packages

An integrated circuit (IC) package assembly, comprising:

• a base printed circuit board (PCB);
• and
• a set of IC packages, each comprising a support component and an IC chip, the IC chip mounted on or partly in the support component, where the support component mechanically supports and electrically connects to the IC chip, wherein:
• the base PCB and each of the support components are rigid, and
• the support component of each of the IC packages is laterally soldered to said base PCB such that a first beveled surface of each of the support components contacts the base PCB and is arranged transversally to said base PCB to form an angle α therewith, so as to form a slanted stack of the IC packages that are essentially parallel to each other, and wherein each of the support components comprise a second beveled surface opposite the first beveled surface.