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US 10,321,579 B2Granted
Solder resist and printed wiring board
AssigneeIbiden Co., Ltd.
InventorYuji Ikawa
Life of this patent
Estimating the term…
Abstract
A solder resist includes a lower layer including a first resin and particles, and an upper layer including a second resin and formed on the lower layer. The particles are one kind selected from a group of inorganic particles, and the upper layer is formed such that the upper layer does not contain any kind of particles belonging to the group of inorganic particles.
Claims20
A solder resist, comprising:
- a lower layer comprising a first resin and a plurality of particles;
- and
- an upper layer comprising a second resin and formed on the lower layer such that the upper layer has an upper surface that is a roughened surface,
- wherein the first resin of the lower layer includes a first epoxy resin, the second resin of the upper layer includes a second epoxy resin, the plurality of particles is one kind selected from a group of inorganic particles, the upper layer is formed such that the upper layer does not contain any kind of particles belonging to the group of inorganic particles and has a thickness that is smaller than a thickness of the lower layer, and the first resin in the lower layer and the second resin in the upper layer are made such that the second resin has a curing temperature that is higher than a curing temperature of the first resin.
1 more element
A printed wiring board, comprising:
- an outermost resin insulation layer;
- an outermost conductive layer formed on the outermost resin insulation layer;
- and
- a solder-resist layer formed on the outermost resin insulation layer and having a plurality of opening portions formed such that the opening portions are exposed portions of the outermost conductive layer,
- wherein the solder-resist layer comprises a lower layer comprising a first resin and a plurality of particles, and an upper layer comprising a second resin and formed on the lower layer such that the upper layer has an upper surface that is a roughened surface, the first resin of the lower layer includes a first epoxy resin, the second resin of the upper layer includes a second epoxy resin, the plurality of particles is one kind selected from a group of inorganic particles, the upper layer is formed such that the upper layer does not contain any kind of particles belonging to the group of inorganic particles and has a thickness that is smaller than a thickness of the lower layer, and the solder-resist layer is made such that the second resin in the upper layer has a curing temperature that is higher than a curing temperature of the first resin in the lower layer.
2 more elements
Dependencies are inferred from the claim text.