Integrated circuit (IC) module comprising an integrated circuit (IC) package and an interposer with embedded passive components

A device comprising:

• an integrated circuit (IC) package;
• a plurality of first solder interconnects coupled to the IC package;
• an interposer coupled to the IC package through the plurality of first solder interconnects such that the IC package is located externally of the interposer, the interposer comprising:
• an encapsulation layer formed entirely by a single layer, the encapsulation layer comprising a first outer surface and a second outer surface, wherein the second outer surface is opposite to the first outer surface, the first outer surface of the encapsulation layer defines a first interposer outer surface, and the second outer surface of the encapsulation layer defines a second interposer outer surface;
• at least one via extending through the entirety of the encapsulation layer;
• a first passive component at least partially embedded in the encapsulation layer such that the first passive component is co-planar to the at least one via that extends through the entirety of the encapsulation layer, wherein a surface of the first passive component is co-planar to the first outer surface of the encapsulation layer, wherein the first passive component is configured such that an electrical signal travels between the first outer surface of the encapsulation layer and the second outer surface of the encapsulation layer, through the first passive component;
• a second passive component at least partially embedded in the encapsulation layer such that the second passive component is co-planar to the at least one via that extends through the entirety of the encapsulation layer, wherein the first passive component and the second passive component are located in the encapsulation layer such that the first passive component and the second passive component are offset towards the first outer surface of the encapsulation layer;
• a plurality of interconnects coupled to the plurality of first solder interconnects, wherein the plurality of interconnects is at least partially formed in the encapsulation layer;
• wherein at least one interconnect from the plurality of interconnects is coupled to the first passive component, and
• wherein at least one other interconnect from the plurality of interconnects is coupled to the second passive component;
• a plurality of second solder interconnects coupled to the interposer;
• and
• a printed circuit board (PCB) coupled to the interposer through the plurality of second solder interconnects.