Electronic component-embedded substrate and electronic component device
AssigneeShinko Electric Industries Co., Ltd.
InventorsJunji Sato, Katsuya Fukase
Life of this patent
Estimating the term…
Abstract
An electronic component-embedded substrate includes a core substrate, a cavity penetrating the core substrate, a wiring layer formed on one surface of the core substrate, a support pattern extending over the cavity and configured to divide the cavity into a plurality of component embedding areas, an insulation wall portion arranged on a part of the support pattern in the cavity and formed of the same material as the core substrate, a plurality of electronic components each of which is mounted in each of the plurality of component embedding areas, and an insulating material filling an inside of the cavity.
Claims11
An electronic component-embedded substrate comprising:
- a core substrate;
- a cavity penetrating the core substrate;
- a wiring layer formed on one surface of the core substrate;
- a support pattern bridging over the cavity and directly contacting opposed edges of the core substrate defining the cavity, the support pattern configured to divide the cavity into a plurality of component embedding areas;
- an insulation wall portion arranged on only part of the support pattern in the cavity, with another part of the support pattern in the cavity being exposed from the insulation wall portion, the insulation wall portion being disposed in the cavity, the insulation wall portion being formed of a same material as the core substrate;
- a plurality of electronic components each of which is mounted in each of the plurality of component embedding areas;
- and
- an insulating material filling an inside of the cavity.
An electronic component device comprising:
- an electronic component-embedded substrate including
- a core substrate,
- a cavity penetrating the core substrate,
- a wiring layer formed on one surface of the core substrate,
- a support pattern bridging over the cavity and directly contacting opposed edges of the core substrate defining the cavity, the support pattern configured to divide the cavity into a plurality of component embedding areas,
- an insulation wall portion arranged on only part of the support pattern in the cavity, with another part of the support pattern in the cavity being exposed from the insulation wall portion, the insulation wall portion being disposed in the cavity, and the insulation wall portion being formed of a same material as the core substrate,
- a plurality of first electronic components each of which is mounted in each of the plurality of component embedding areas, and
- an insulating material filling an inside of the cavity;
- and
- a second electronic component mounted on the electronic component-embedded substrate and electrically connected to at least one of the first electronic components.
Dependencies are inferred from the claim text.