Composite chip component, circuit assembly and electronic apparatus

A composite chip part comprising:

• a substrate having a front surface, a rear surface, and a side surface perpendicular to the front and rear surfaces, the substrate made of silicon;
• a plurality of chip elements arranged a distance apart from each other on the front surface of the substrate and having different functions;
• a protective layer formed on the front surface of the substrate and having a pair of openings;
• a pair of electrodes formed on only the front surface of the substrate in each of the plurality of chip elements such that each of the pair of electrodes protrudes upwardly from the protective layer and has a portion larger than each of the pair of openings in a plan view;
• an insulating film interposed between the pair of electrodes and the substrate such that the insulating film covers the side surface of the substrate;
• and
• a wiring film formed on the front surface of the substrate such that one electrode of the pair of electrodes is electrically connected to the wiring film, the wiring film having a taper shape in a sectional view,
• wherein the pair of electrodes are respectively arranged on one side of the front surface of the substrate and an opposite side of the front surface of the substrate opposite to each other,
• wherein the rear surface of the substrate is an exposed polishing surface,
• wherein the substrate is capable of being surface mounted on a mounting object via the pair of electrodes, and
• wherein a part of the wiring film covered by one electrode of the pair of electrodes is selectively exposed via a cut-out portion of a resin film, and another part of the wiring film is selectively covered by the resin film.