Method for producing electronic components

A method of producing electronic components for acquiring a plurality of electronic components by cutting, along a predetermined cutting line, a laminate including a first circuit board and a second circuit board both mounted with circuit components, the method comprising:

• a stacking step of stacking the second circuit board on the first circuit board with a spacer interposed therebetween, the first circuit board being provided with a filled via around a mounting region of the circuit components of the first circuit board thus forming the laminate;
• a filling step of filling a filling space formed between the first circuit board and the second circuit board using the spacer with an insulating resin;
• and
• a cutting step of cutting the laminate along the cutting line, the cutting line dividing the filled via, and exposing the filled via from a cut surface to acquire terminal portions of the electronic components,
• wherein the filling space formed between the first circuit board and the second circuit board includes a first filling space formed inside the mounting region,
• wherein the filling space formed between the first circuit board and the second circuit board further includes a second filling space formed outside the mounting region and communicating with the first filling space,
• the first filling space and the second filling space are partitioned by the spacer,
• the spacer has a communication opening communicating the first filling space with the second filling space, and the communication opening is filled with the insulating resin in the filling step.