Printed wiring board and method of manufacturing the same

A printed wiring board, comprising:

• an insulating layer;
• a first conductive layer formed on one surface side of the insulating layer;
• and a second conductive layer formed on another surface side of the insulating layer;
• wherein the first and second conductive layers are electrically connected via a conductor that fills a through hole penetrating the insulating layer from the one surface side to the another surface;
• wherein the through hole includes a tapered section whose opening diameter decreases from the one surface to the another surface of the insulating layer, the tapered section having a minimum opening diameter section, and includes a cylindrical section that communicates with the tapered section at the minimum opening diameter section and intersects with the another surface, wherein a thickness of at least part of the conductor varies in accordance with a decrease in opening diameter of the tapered section, wherein an opening of the cylindrical section has a smaller radius of curvature than an opening of the tapered section, wherein the cylindrical section overlaps at least a portion of the tapered section and is structured such that at least part of the conductor is positioned between opposing curved portions of the respective openings of the tapered section and the cylindrical section, which respectively coincide with the one surface and the another surface of the insulating layer, and wherein the conductor has a first recess extended further from the another surface than a second recess extended from the one surface.