Solder assembly of pins to the peripheral end face of a printed circuit board

A printed circuit board assembly comprising:

• a first printed circuit board (PCB) having top and bottom areal main faces (AMF) and a peripheral end face (PEF) having a flat surface of predetermined width separating the top and bottom AMF;
• a second PCB having at least a top AMF surface;
• the first PCB comprising:
• a laminate substrate;
• and
• conductive wiring at one or more multiple layers embedded within the substrate, the conductive wiring adapted for connection to various PCB AMF mounted devices, the embedded conductive wiring at the multiple layers includes multiple conductive wire ends exposed at multiple locations along the flat PEF surface;
• a conductive contact structure formed at the flat PEF surface and in conductive contact with one or more of the exposed conductive wire ends;
• and
• one or more conductive pins of a polygonal structure having a planar bottom surface and opposing planar contact surfaces, one planar contact surface of the conductive pins attached to the conductive contact structure at the flat PEF surface and a pin extending from the PEF surface in a substantially perpendicular orientation relative to a top or bottom AMF of the first PCB, and
• an opposing planar contact surface of each of the one or more the pins of polygonal structure is adapted for surface mounting the PCB on corresponding one or more corresponding conductive contacts formed on an AMF surface of the second PCB to form a PCB assembly, the first PCB mounted in a substantially perpendicular orientation on the AMF surface of the second PCB with the flat PEF surface of the first PCB facing the AMF surface of the second PCB, and wherein the first PCB includes an opposing flat PEF surface, said PCB assembly further comprising:
• a conductive contact structure formed at the opposing flat PEF surface of said first PCB;
• a solder attached conductive pin connected to a respective conductive contact structure formed at said opposing PEF surface, said attached conductive pin comprising:
• a first polygonal structure portion extending outward in a substantially perpendicular orientation relative to the opposing flat PEF surface,
• a second polygonal structure portion extending vertically at a right angle relative to the first polygonal portion toward the AMF of the second PCB of the assembly in an orientation parallel to a planar AMF surface of said first PCB, and
• a bottom foot portion having an extended planar contact surface for connection directly on a corresponding contact formed on the AMF surface of said second PCB.