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US 10,321,563 B2Granted
Apparatus and associated methods for deformable electronics
AssigneeNokia Technologies Oy
InventorsAdam Robinson, Darryl Cotton, Piers Andrew
Life of this patent
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AssigneeNokia Technologies Oy
InventorsAdam Robinson, Darryl Cotton, Piers Andrew
Estimating the term…
An apparatus comprising a deformable substrate, an electrical interconnect suitable for interconnecting one or more electronic components located on the deformable substrate to one another or to one or more electronic components located on another substrate, and a support beam configured to couple the electrical interconnect to the deformable substrate, wherein the electrical interconnect comprises one or more curved sections and adjoining straight sections, and wherein the electrical interconnect is attached to the support beam via the adjoining straight sections such that the one or more curved sections are suspended over the deformable substrate to enable the electrical interconnect to accommodate strain when the deformable substrate undergoes operational deformation.
An apparatus comprising a deformable substrate, an electrical interconnect suitable for interconnecting one or more electronic components located on the deformable substrate to one another or to one or more electronic components located on another substrate, and a support beam positioned between the electrical interconnect and the deformable substrate, wherein said support beam is configured to couple the electrical interconnect to the deformable substrate and maintain the electrical interconnect in a position which is spaced from the deformable substrate so that the electrical interconnect and the deformable substrate are separated from each other, wherein the electrical interconnect comprises one or more curved sections and adjoining straight sections, and wherein the electrical interconnect is attached to the support beam via at least one of the adjoining straight sections such that the one or more curved sections are suspended over the deformable substrate so as to be free to move relative to the deformable substrate to enable the electrical interconnect to accommodate strain when the deformable substrate undergoes operational deformation.
An apparatus comprising a deformable substrate, an electrical interconnect suitable for interconnecting one or more electronic components located on the deformable substrate to one another or to one or more electronic components located on another substrate, and a support beam positioned between the electrical interconnect and the deformable substrate, wherein said support beam is configured to couple the electrical interconnect to the deformable substrate and maintain the electrical interconnect in a position which is spaced from the deformable substrate so that the electrical interconnect and the deformable substrate are separated from each other, wherein said support beam at least partially overlies said deformable substrate, wherein the electrical interconnect comprises one or more curved sections and adjoining straight sections, and wherein the electrical interconnect is attached to the support beam via at least one of the adjoining straight sections such that the one or more curved sections are suspended over the deformable substrate to enable the electrical interconnect to accommodate strain when the deformable substrate undergoes operational deformation.
An apparatus comprising a deformable substrate, an electrical interconnect suitable for interconnecting one or more electronic components located on the deformable substrate to one another or to one or more electronic components located on another substrate, and a support beam positioned between the electrical interconnect and the deformable substrate, wherein said support beam is configured to couple the electrical interconnect to the deformable substrate and maintain the electrical interconnect in a position which is spaced from the deformable substrate so that the electrical interconnect and the deformable substrate are separated from each other, wherein the electrical interconnect comprises one or more curved sections and adjoining straight sections, and wherein the electrical interconnect is attached to the support beam via at least one of the adjoining straight sections such that the one or more curved sections are suspended over the deformable substrate and off to at least one side of the support beam to enable the electrical interconnect to accommodate strain when the deformable substrate undergoes operational deformation.
Dependencies are inferred from the claim text.