Dummy core plus plating resist restrict resin process and structure

A printed circuit board comprising:

• a. a rigid printed circuit board portion comprising a laminated stack of a plurality of non-conducting layers and a plurality of conductive layers, wherein the laminated stack further comprises a first portion of an inner core structure;
• and
• b. a semi-flexible printed circuit board portion comprising a second portion of the inner core structure and exposed plating resist, wherein the inner core structure is a continuous structure that extends through both the rigid printed circuit board portion and the semi-flexible printed circuit board portion, further wherein the second portion of the inner core structure comprises exposed inner core circuitry, wherein the plating resist is limited to the semi-flexible printed circuit board portion of the printed circuit board and is limited to contacting a side wall of the rigid circuit board portion corresponding to a non-conducting layer of the rigid printed circuit board portion and the second portion of the inner core structure immediately adjacent the side wall of the rigid circuit board portion, further wherein the inner core structure comprises an inner core non-conductive layer having a first surface and a second surface opposite the first surface, and the first surface and the second surface of the inner core non-conductive layer form a continuous planar surface across the entire semi-flexible printed circuit board portion.