Display device and method for detecting bonding condition in bonding area of display device
AssigneeBoe Technology Group Co., Ltd.
InventorsSong Meng, Danna Song
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AssigneeBoe Technology Group Co., Ltd.
InventorsSong Meng, Danna Song
Estimating the term…
The display device comprises a printed circuit board, a display panel and a chip on film for connecting the printed circuit board with the display panel. The chip on film comprises a plurality of output pads and a plurality of first test pads which are close to the plurality of output pads and arranged at intervals. The display panel comprises a plurality of input pads in one-to-one correspondence with the plurality of output pads of the chip on film, and a plurality of second test pads which are close to the plurality of input pads of the display panel and arranged at intervals. A gap between two adjacent first test pads of the chip on film overlaps a second test pad of the display panel such that the two adjacent first test pads of the chip on film are connected via the second test pad of the display panel.
A display device comprising a printed circuit board, a display panel and a chip on film for connecting the printed circuit board with the display panel, the chip on film comprising a plurality of output pads, the display panel comprising a plurality of input pads, each one of the plurality of input pads corresponding to and coupled with a respective output pad of the plurality of output pads, wherein the chip on film further comprises a plurality of first test pads which are spaced from the plurality of output pads of the chip on film and arranged at intervals, the display panel further comprises a plurality of second test pads which are spaced from the plurality of input pads of the display panel and arranged at intervals,
Dependencies are inferred from the claim text.